Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working Part No: H7468001

Part No: H7468001

Sold as a Lot of 2 This Magnon Engineering 10650 X & Y Axis Driver PCB Card is used working surplus

img{max-width:100%} Varian Semiconductor Equipment E15002180 PREDEP Communications Expander PCB New

Inventory # A-18368

Inventory # AA-2554

Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working Part No: H7468001Rudolph Technologies AT SM Die Prep Kit F30 300mm Wafer Defect System Working Inventory # A 19531 Model No: AT SM Die Prep Kit Removed from a Rudolph Technologies F30 300mm Wafer Mounter & Defect Inspection System Included Components Part No: 734202, Rev. A Part No: F30 Chuck O Ring Part No: Retaining Nut NSK Part No: HGP NZ1 NKS Part No: AFE CA, X Y AXIS NKS Part No: LG2, Z AXIS This Rudolph Technologies AT SM Die Prep Kit is used working surplus.